研討會論文

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年度 論文名稱
2026 Lo, S.M.*, 2026.05, 'Dynamic Resilience Building under Geopolitical Pressures: A Study of Strategy Evolution in Taiwan’s Semiconductor Industry, ' 36th Annual POMS Conference (2026), Production and Operations Management Society (POMS).(*為通訊作者), May. 2026
2026 Pham, T.P.*;Lo, S.M., 2026.05, 'The Dual Role of Sustainability Disclosure in Linking Sustainable Operational Practices to Firm Sustainable Performance, ' 36th Annual POMS Conference (2026), Production and Operations Management Society (POMS).(*為通訊作者), May. 2026
2025 Yeun-Wei Hwang;Hsin-Lu Chang*, 2025.12, 'A Strategic Framework for Cloud Adoption in Banking, ' Proceedings of Pre-ICIS DIGIT Workshop, Association of Information Systems.(*為通訊作者), Dec. 2025
2025 Zivan Zih-Huan Huang;Hsin-Lu Chang*, 2025.12, 'Virtual-Physical Contextual Integration and The Design of Mixed Reality Museum Exhibitions to Enhance Visitor Place Attachment, ' Proceedings of Pre-ICIS Workshop on E-Business, Association of Information Systems.(*為通訊作者), Dec. 2025
2025 Lo, S.M.*;Wu, T.N., 2025.12, 'Smart Transportation and Logistics Management (STLM) for Sustainable E-commerce: Evidence from a Taiwanese Platform, ' The 5th International Conference on Smart City and Green Energy (ICSCGE 2025), Monash University.(*為通訊作者), Dec. 2025
2025 王政憲*;柯玉佳, 2025.12, '探討臺灣地熱發展的社會科技情境：情境分析與利害關係人參與之整合方法, ' 中華民國科技管理學會年會暨論文研討會, 中華民國科技管理學會、國立清華大學科管院.(*為通訊作者), Dec. 2025
2025 簡齊萱*;柯玉佳, 2025.12, '以專利數據進行資料中心冷卻技術之預測分析研究, ' 中華民國科技管理學會年會暨論文研討會, 中華民國科技管理學會、國立清華大學科管院.(*為通訊作者), Dec. 2025
2025 諶家蘭, 2025.12, 'Метафорическая репрезентация концепта «путь» в обращении Цай Ин-вэнь по случаю дня двух десяток 2021 года и особенности его передачи на русский и английский языки, '., Dec. 2025
2025 Chiao-Yin Yu*;林怡伶, 2025.12, 'Robotic Reminiscence Therapy for Strengthening Elders' Psychological Resilience, ' ICIS, AIS.(*為通訊作者), Dec. 2025
2025 Yang, SF*;Liou, Jerry;Gan, SJ;Lin, S, 2025.12, 'A New Anomaly Detection Approach for Monitoring PM2.5 in New Taipei City, ' International Conference on Artificial Intelligence, and Manufacturing Engineering, AFTER.(*為通訊作者), Dec. 2025